Dynamic Thermal Design of an Active Power Cycling Test Bench for SiC MOSFETs

This paper presents an active power cycling approach whereby the inputs and outputs of two three-phase inverters are coupled in order to achieve circular energy flow. Focus is put on the thermal design of the test setup which concentrates on achieving short thermal cycles and high temperature dynamic for accelerated lifetime tests of SiC MOSFETs. These goals are achieved by the application of custom 3D-printed aluminum heat sinks and by using non-constant flow of the cooling medium.