Application of Confocal Microscopy Methods for Research and Non-destructive Examination of Semiconductor Structures and Integrated Circuits

The paper discusses the features and the possibilities of the under-development scanning confocal microscope in tasks of non-destructive examination of semiconductor electronics using the method of confocal microscopy with an emphasis on the possibility of studying the material and internal structure. The described technique allows studying integrated circuits from the substrate side of integrated circuits. This work is part of a global task and is devoted to mathematical modeling of the scanning process.