Research on the board level reliability of CQFJ ceramic package

In this paper, the finite element method is used to simulate the board level temperature cycling, mechanical impact and random vibration tests of CQFJ ceramic package. The stress and strain distribution of solder joints under different test conditions are analyzed. At the same time, we make special test boards and board level installation. The simulation results of relevant mechanical and temperature tests are verified. After the board level installation, the product meets the requirements of reliability test, forming a guide for the subsequent design of new products. The results show that under the condition of the same device size and total height, the stress relief ability of CQ F J lead out packaging structure is better than CLCC packaging structure. The J-type lead is more conducive to absorb the stress caused by the mismatch of thermal expansion coefficient between the package and PCB. Therefore, the use of ceramic four side J-type lead flat package can improve the reliability at the of premise of compatible pad size, and realize the compatible replacement of the large size CLCC package. Through this research, we have mastered the CQ F J ceramic package board level reliability simulation analysis and verification technology, which can quickly design and manufacture similar ceramic package to meet the needs of different users.