Reliability Analysis of Thermal Interface Materials (TIMs) in large size FCBGA package

In large size package, high temperature affects the stability, reliability and service life of electronic components. The thermal interface material (TIM) plays an important role of effectively enhancing the heat transfer in Flip Chip Ball Grid Array (FCBGA) package; therefore reliability of TIM is indispensable especially when the package device needs to withstand wide high and low temperature periods. In this paper, we conduct a detailed analysis of TIM's reliability in large-size FCBGA package by simulating the stress and strain of TIM layer with the finite element software ABAQUS. The stress of TIM in the package is complex and can be affected by multiple factors such as device structure, material parameters, etc. It is necessary to check the model structure and material parameters to correctly understand the stress of TIM in FCBGA. The statistics method is adopted for analyzing the influence of various parameters.