Defect Localization and Optimization of PIND for Large Size CQFP Devices

CQFP devices have been widely used in aerospace, military and other fields due to the advantages of high reliability [1], but large-size CQFP devices are prone to failure after PING test. This paper uses ANSYS Workbench to locate the defect and verify it by scanning electron microscope (SEM). The verification results are consistent with the simulation results. In addition, a test fixture was used to optimize the PIND test process, and the results show that the use of test fixture can effectively reduce the risk of device failure.