Strain rate and temperature effects on tensile properties of monocrystaline Cu6Sn5 by molecule dynamic simulation

In the soldering of electronic products with Cu as the substrate, intermetallic compounds (IMCs) which main component is Cu
6
Sn
5
is usually generated. Solder joint cracking in electronic products usually occurs in the IMC layer or between IMC and solder, so the mechanical properties of IMC will affect the mechanical properties of the whole solder joint. In this paper, a 5×5×5 supercell was built, and the molecular dynamics (MD) simulations were performed using a Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) with the MEAM potential function. The tensile properties of single crystal Cu
6
Sn
5
have been studied. Tensile direction in this paper is along X axis. The stress-strain curves at different strain rates and different temperatures are analyzed. The influencing factors considered in this paper are temperature and strain rate. According to the results of simulation analysis, it is found that the stress-strain curves at higher strain rate is always above the curve at lower strain rate before the IMC cracked. For the same strain rate, the higher the temperature, the lower the yield strength of Cu
6
Sn
5
. The elongation before the stress - strain curve declining with larger strain rate is bigger than that with smaller one. UTS of the Cu
6
Sn
5
increase as increment of the strain rate. Elongation corresponding to UTS also appears the same changing trend, a larger stains rate corresponds to lager elongation of the UTS.