Micron-Scale Silver Flake Paste Sintering Without Pressure for Power Electronic Die Attachment

With the development of power electronics, metal particle sintering, especially Ag particle sintering technology has gained much attentions. In this work, different sintering parameters such as sintering time, temperature and assisted pressure were taken into consideration to evaluate the performances of micron-scale Ag flake paste. The shear strength of the sintered joints prepared with micron-scale silver flake paste reached as high as 26.5 MPa after sintering at 250°C for 30 min without pressure under atmosphere condition.