ATE board design solution of small PIN pitch DUT

With the development of the semiconductor industry towards Moore's law, more and more IC with higher integration but smaller size appears in the market, which also means that small PIN pitch IC will become an irresistible trend. This also brings great difficulty to the design and manufacture of ATE (Automatic Test Equipment) board. ATE board is the interface of DUT (Device Under Test) and ATE, it is a special PCB using in the process of IC test. If the PIN pitch less than 0.35mm, the via hole size always should less than 0.15mm, and ATE board thickness normally should more than 3mm. If aspect ratio more than 27: 1, that will be a big challenge of manufacture. However, more and more small pitch DUT appears and the application always request high board thickness, how to solve this problem on design solution side is the key point of this paper. The example we use is a 0.3mm PIN pitch DUT, board thickness is 3.6mm, via hole diameter is 0.13mm. This parameter is difficult for many factories to manufacture. We provide a solution to make most factories can manufacture it. The solution is use SVH (Stack Via Hole), the board is divided into two parts for secondary compression, upper side thickness is 3mm, down side thickness is 0.6mm, then, upper side layers can use small hole size vias, down side layers should use more big size via (also can fanout by small size via from upper side). Based on this solution we completed the design and the design can be manufactured. Our paper will provide detail design solution, simulation result and manufacture parameters for providing a solution reference of small PIN pitch DUT ATE board design.