Reflow Soldering Process Optimization Based on Surface Evolver Solder Joint Shape Simulation and Finite Element Analysis of PCB Assembly

In view of the complexity and high cost of temperature curve setting in reflow soldering process of multi variety and small batch products, and the existing process simulation methods of PCB components lack of comprehensive consideration of solder paste printing volume and IMC growth and other internal factors resulting in unstable simulation results, the Surface Evolver interactive software is used to establish the physical shape simulation model of solder joints of components, and the IMC growth dynamic model is established based on the principle of atomic diffusion in the reflow process. Then it is creatively combined with the simulation results of reflow soldering process. Through the simulation curve output simulation solder joint model, and then establish the best process parameters window according to the solder joint appearance size, IMC thickness and other parameters, which provides a new research method for PCB assembly reflow soldering process simulation optimization.