Hybrid-Embedded SIP Package Design

This paper discusses some of the challenges encountered when moving from a SIP package to Hybrid package technology with combination of flip Chip (controller die) and wire bonding (NAND die) inside one package, where one design has a Hybrid-side by side (Hybrid-SBS) SIP package structure. Due to controller and NAND die size growth with more IOs and capacity, Hybrid-SBS SIP package requires a form-factor change. Thus, Hybrid-Embedded SIP Package structure maybe more suitable for next generation SIP package. In this paper, Hybrid-Embedded SIP Package structure is introduced and challenges of this package structure and package routing are discussed.