A universal approach for photonic integration on flexible substrates

Photonic devices hold unique advantages over electronic devices in material sensing specificity, channel capacity, resistance to electromagnetic interference, noninvasive and precise stimulation. Integrated photonics that is mechanically flexible open up emerging applications in the field of conformal sensing, flexible optical interconnects, and biotechnology [1] – [3] . However, there currently exist challenges in device fabrication, mechanical flexibility, and the degree of integration for the functionality exploration of flexible photonics. We have been making progress based on inorganic optical thin films to overcome the aforementioned challenges. In 2014, we developed a monolithic 3D integration technology for bendable photonic devices, which is only applicable to optical thin films deposited and processed at low temperatures [4] .