Space test of photonic integrated materials and devices

As a lightweight and low power alternative to the fiber-based RF-photonic components, photonic integrated circuits (PICs) are well suited for aerospace applications and, in particular, for free-space communications and remote sensing/imaging. In this work we present the design, fabrication, and space radiation testing of high-speed PICs as a means to elevate their technology readiness level (TRL) for avionics. Our efforts focus on improving the efficiency and bandwidth of thin-film lithium niobate and silicon-based devices as well as studying their envrionmental stability for aerospace applications. These devices will be compared between pre- and post-radiation silicon photonic devices for a space environment of near earth orbit.