Self-Aligning Ruthenium Interconnects

This contribution shows self-aligning ruthenium interconnects. The underlying process is gas phase electrodeposition, which allows metallic particles to be deposited locally. This is performed with an adjustable airgap between the insulator and the deposited metallic structure. The size of the enclosed airgap can be adjusted directly. The deposition power has a direct influence on the growth rate and the morphology of the structure. With increasing deposition power, the resulting self-aligning nano-bridge becomes more compact.