3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems

We present CMOS-compatible 3D coin architecture interconnect technology for enabling manufacturable heterogeneously integrated physically compliant electronic systems (< 1 mm bending radius). The interconnect technology along with the integration scheme shall maximize the area efficiency by having sensors on one side of the soft-polymeric platform (one side of coin) and other data processing, storage, and energy (solid-state battery) sandwiched within the polymeric encapsulation. Other side of the coin is used for RF/communication and energy harvesting module. Such an architecture will be an enabling factor in realization of truly flexible electronic platforms for IoT and implantable applications of next generation.