New Processes and Materials for Future Logic Devices

For more than five decades the industry has enabled simultaneous improvements in power performance and area scaling primarily by a relentless shrink in two dimensions. While the availability of EUV has made it even easier to pattern smaller features, materials start to become critical bottlenecks at these dimensions. Furthermore, manufacturing processes and approaches that that have been used for decades, may no longer meet device requirements to fabricate the smaller features. New materials as well as new process solutions must be adopted. Some of the challenges to materials and processes, and potential approaches to addressing these will be discussed in this paper.