Segmented Thermal Management with Flash Cooling for Heterogeneous Wafer-Scale Systems

Wafer-scale systems comprise a promising packaging technology that allows efficient system scaling for high-performance computing. These systems require high power density and ultra-high-heat flux removal to enable expected intensive compute workloads. Silicon Interconnect Fabric is a wafer-scale, fine-pitch heterogeneous integration platform that enables high package density by supporting dielet assembly at fine spacing. Fine-pitch integration in wafer-scale systems enables high packing density of dielets that leads to peak heat flux density up to 3 W/mm
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. These requirements can vary significantly based on the needs of the heterogeneous components present in the system with an estimated total power delivery of 40 kW for a 300 mm system leading to an average heat flux density of 1 W/mm
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. Segmented thermal management is supported by flash cooling - a dynamic, high-heat flux cooling technique to handle temperature peaks in high-performance electronic components. This two-phase cooling approach has shown to produce peak heat transfer coefficients of 50,000 W/m
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K. A thermal management module is built on the Silicon Interconnect Fabric which consists of individual flash chambers of 40 mm x 40 mm each. These units can be individually designated to perform pulsed, anticipatory cooling, thus allowing zonal arrangement of heterogenous dielets. A detailed characterization of pulsed cooling and transient thermal response of individual flash chamber is reported.