Integrated Stacked Silicon Microcoolers

In a previous study [1], the authors have investigated stacked silicon microcoolers and quantified their thermal performance envelope in a separable format where the microcooler is attached to an electronic package lid with an intervening TIM2. In this study, we expand the previous study by integrating the stacked microcoolers into an electronic package, i.e., by removing the lid and the TIM2. A summary of thermal resistance and pressure drop experimental data spanning a wide range of fluid flow rates is presented. Additionally, numerical modeling using FEA/CFD models is conducted and the results compared to the experimental data. Results reveal that the thermal performance of the integrated microcoolers is ~ 30% superior that of the separated microcoolers. The numerical model results accurately predict the experimental data to within 20%. Directions for future thermal performance improvements using multiple inlet/outlet ports and varying the number of cooler stacks are identified using the numerical models.