Chipscale Piezo-Magnetostrictive Interfaces - A new simplified and microminiaturized telemetry paradigm for Medical Device Packages

Miniaturized 3D package integration with piezo-magnetostrictive telemetry is analyzed towards advanced wireless medical systems. The paper is composed of three aspects. The first is to analyze telemetry using a multiferroic or piezo-magnetostrictive power interface. Parametric analysis was performed to estimate the impact of material, geometry and input magnetic fields. The second aspect is the process integration of devices and telemetry interfaces in 3D embedded packages for smallest form-factors. The telemetric interface and sensor devices are packaged in a flexible substrate with 3D interconnections, leading to miniaturized solutions. The sensor-communication and the power source flex layers are separately fabricated and connected with via-fill layers that are flex-compatible. Flex integration allows the devices to be functional on curved surfaces. In the final part, coupled magnetostrictive and piezoelectric films were considered to power devices in neural recording, neurostimulation and biophotonic systems. Power analysis requirements and piezo-magnetostrictive solutions for these specific scenarios is shown to illustrate the geometric compatibility towards emerging needs.