Warpage Estimation of Heterogeneous Panel-Level Fan-Out Package with Fine Line RDL and Extreme Thin Laminated Substrate Considering Molding Characteristics

To meet the requirements of achieving high density and heterogeneous integrations, fan-out Panel level packaging (FOPLP) technology regarded as one of the promising alternative solutions has the capability of providing heterogeneous integrations, compared with fan-out Wafer level package (FOWLP), FOPLP enhances the usage ratio from FOWLP to reduce the fabricated cost. With Moore's Law, many reliability issues have occurred, warpage induced by coefficient thermal expansion (CTE) mismatch is the most urgent among these issues. In order to analyze the warpage mechanism, a FOPLP vehicle has been proposed in this study. The vehicle with multi-layer design is fabricated with a $510 \text{mm} \times 515 \text{mm}$ panel size and subsequently cut into 960 single packagings for assembly. The foregoing FOPLP structure with multiple redistribution layers (RDL) and dielectric layers is utilized to observe warpage. To achieve the target of predicting and controlling the warpage, the finite element method (FEM) is widely adopted. In finite element (FE) model, the complex structure should be simplified by using equivalent material approach to avoid scale mismatch. Following the warpage estimated by FEM is validated, this paper would analyze the warpage process-induced and provide the comment for improving the reliability of FOPLP.