A New FOWLP Platform for Hybrid Optical Packaging - Demonstration on 100Gbps Transceiver | IEEE Conference Publication | IEEE Xplore

A New FOWLP Platform for Hybrid Optical Packaging - Demonstration on 100Gbps Transceiver


Abstract:

The Fan Out Wafer Level Packaging, widely used in the silicon semiconductor system, is introduced for all-in-one hybrid optical package with small form factor, potentiall...Show More

Abstract:

The Fan Out Wafer Level Packaging, widely used in the silicon semiconductor system, is introduced for all-in-one hybrid optical package with small form factor, potentially higher performance, and expendability to on-board/co-packaged optical interconnections. To prove the new packaging idea, 100GBASE-SR4 standard is targeted in this demonstration.
Date of Conference: 06-10 June 2021
Date Added to IEEE Xplore: 26 July 2021
ISBN Information:
Conference Location: San Francisco, CA, USA

References

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