Abstract:
We report a hybrid flip-chip-integrated laser attach technology on a monolithic SiPh platform. Efficient laser-to-PIC butt-coupling with optical power up to 11dBm was dem...Show MoreMetadata
Abstract:
We report a hybrid flip-chip-integrated laser attach technology on a monolithic SiPh platform. Efficient laser-to-PIC butt-coupling with optical power up to 11dBm was demonstrated through a combination of precise mechanical stops and optical alignment features.
Date of Conference: 06-10 June 2021
Date Added to IEEE Xplore: 26 July 2021
ISBN Information:
Conference Location: San Francisco, CA, USA
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