3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm
²
bandwidth densities for future co-packaged chipsets. © 2021 The Author(s)