A new press pack IGBT for high reliable applications with short circuit failure mode

The modular multilevel converter (MMC or M2C) technology becomes the mainstream solution in today's voltage source converter-high voltage direct current (VSC-HVDC) transmission lines because of its unique performance. Recently press pack IGBT (PPI) has come into focus as a preferred realization for high power rating VSC-HVDC stations, it could offer the highest current rating IGBTs and advanced features in reliability. A new PPI is introduced in this paper, which is designed for several innovative improvements based on the application demands from VSC-HVDC systems. The chip is optimized for low on-state voltage with advanced trench technology, and well protected in a chip-stack by double side sinter process. The disc package is designed with hermetic sealed ceramic housing to avoid environmental erosion and could provide a robust feature of short circuit failure mode (SCFM), which is fully qualified under the worst-case scenario. In addition to the PPI device, system solutions had also been developed and investigated to support field developments, including electrical and mechanical design. An example of a power stack is analyzed in commutation loop, pressure distribution, and power losses.