Hybrid Variable Capacitor in Impedance Matcher for RF Plasma Process

This paper introduces a novel method to reduce the capacitance variable time by Hybrid Variable Capacitor (hereinafter referred to as HVC) circuit applied in impedance matching circuit of Radio Frequency (hereinafter referred to as RF) plasma system. Until recently, the impedance matcher mainly used a mechanically Vacuum Variable Capacitor (hereinafter referred to as VVC). However, since the capacitance is changed mechanically, a significant portion of the process time is consumed in the matching time. Therefore, in recent years, in order to reduce the matching time, an Electrical Variable Capacitor (hereinafter referred to as EVC) that electrically variable capacitance has been developed using power electronics technology. However, EVC has a problem in that it is bulky and has a small capacitance resolution. Therefore, this paper proposes an HVC, a variable capacitor with a new structure, by combining the advantages of VVC and EVC.