Effect of EMC adhesion strength on Ag plated DCB by plasma treatment

Ag plating is applied on the DCB substrate for the silver sintering process for SiC chip attachment. The SiC chips are attached to the DCB Ag plated area by the Ag sintering process, and then the EMC (Epoxy Molding compound) packaging is performed. However, EMC has a low adhesion strength to the Ag plated surface. So, we confirmed the improvement of EMC adhesion strength to Ag plated DCB substrate by plasma treatment and the result of EMC adhesion strength with power and time of plasma parameters. In this paper, we will introduce the EMC adhesion strength improvement on Ag plated DCB substrate by plasma parameters.