Assembly Technologies for highly integrated Sandwich type Power Modules with WBG Semiconductors

The future of mobility is driven by electronics. Together with autonomous and connected driving, electrically powered vehicles are the key success factor for this. That is why power electronics has been undergoing a fast evolution in the recent years and is bound to evolve constantly in the near future. Wide Band Gap (WBG) semiconductors opened the door to fast switching at higher operating temperatures, but to tap the potential, modules need to be designed as highly integrated, highly reliable, intelligent systems. Modules with sandwich type architecture built as a stack of power substrate, WBG-dies and fine pitch multilayer substrate provide all ingredients for this. In this paper the technologies for the assembly of two such module designs for automotive use are presented. Thereby the two designs slightly differ in every layer: classic copper based AMB and Cu-C (Diamond) based AMB-derivative as power substrates, GaN and SiC semiconductors, LTCC, HTCC and PCB as multilayer topside substrates are used respectively.