Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm
³
. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of -35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.