Stretch Testing of SMD Resistors Contacted by a Novel Thermo-compression Method on a Textile Ribbon

This paper is focused on the dynamic stretch testing of SMD chip resistors that were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, and subsequently melted and cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the SMD component leads (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one same step. The electrical resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles. Results show that the 130 % stretching of prepared samples up to 12000 cycles is possible without significant changes in electrical properties. The electrical resistance of samples with added solder is lower and more stable than the samples without solder.