Improvement of Measurement Devices for Soldering Machines

In mass soldering processes it is necessary to optimize and validate relevant process parameters. For example, in a wave soldering process heating and wave parameters need to be set and the thermal profile and wave contact must be in the right shape and scale. To achieve that it is common to use special thermal profilers with an extension for contact measurement. Our goal is to extend the function of such devices to measure oxygen concentration and vibrations and to provide an interface directly to the machine to analyze and combine the data of the machine and the profiler.