DUT Temperature Coefficient and Power Cycles to Failure

We demonstrated power cycling tests with different temperature coefficient samples and shown that cycles to failure strongly depends upon the coefficient. The test samples are investigated by SAT before and after the failure. As a result, we clarified the relationship between the DUT temperature coefficient and failure mechanism. The temperature coefficient is extremely important as a parameter for power cycle tests. High temperature coefficient can lead shorter cycles to failure by thermal runaway before bonding wire disconnection. We also proposed a new method to control temperature coefficient of DUT with gate voltage clamping to drain voltage.