Development of Semi-Analytical Formulation for Asymmetric Warpage Prediction in Fan-Out Reconstitution Process

Asymmetric warping is an annoying phenomenon impacting the packaging reliability and must be reduced by modifying design and process parameters through proper prediction. Traditionally, highly meshed finite element simulations are usually used. However, its cost and case study nature make this approach less effective in early design phase. Instead, in this work, a semi-analytical formulation is presented for providing analytical prediction as a cost effective approach. The model proposed by Freund is served as the core to confirm the physical influence of key design variables and is further modified by considering the effects of material properties and structural geometry through finite element simulation to ensure the numerical accuracy. Finally, this formulation is numerically validated and shall be useful for adjusting layout, materials, and processing parameters, in packaging design.