Integrated Simulation of Electrical and Thermal Processes in Optoelectronic Devices Designing

The article studies the mutual influence of electrical and thermal processes due to their simultaneous occurrence in the printed circuit assemblies of optoelectronic devices (OEDs) in real operating conditions. An increase in the accuracy of computer modeling of electrical and thermal processes can be achieved by switching from the separate modeling of these processes used in engineering practice to their joint simultaneous modeling according to the proposed unified integrated electrothermal model. The authors use the existing in physics electrothermal analogy of mathematical descriptions of these processes. The resulting loads of heat dissipations power and temperatures of electrical radio products placed on the OED printed circuit boards makes it possible to identify hidden potential failures in them during design. When using integrated digital twin, it is possible to identify pre-failure situations during the operation of the OED.