An Epoxy Composite Film for Modified Semi-Addictive Process

Epoxy composites are widely used in advanced electronic packages owing to their advantages of easy processing and high reliability. Herein, an epoxy composite film was developed and used as a dielectric layer for fabricating fine line/space circuit adopting the modified semi-addictive process (mSAP). The key steps in mSAP, such as lamination, laser drilling, desmearing and electro-less/electro plating, were studied and analyzed.