Micron-size bending radii in silica-based waveguides

A technology that allows small bending radii and large-angle waveguide T's would enable denser integration and smaller structures. We present here theoretical results and are currently preparing experimental evidence on a method that can increase the density of integration by orders of magnitude. A reduction in bending radius by a factor of 30-500, and of the complete bend structure dimension by 10-100 times, is predicted. The proposed air trench solution is demonstrated by design of a waveguide bend and T-splitter by FDTD method.