An Ultrawide Ku- To W-Band Array Antenna Package Using Flip-Chipped Silicon Integrated Passive Device With Multilayer PCB Technology

A new antenna-in-package (AiP) solution for a tightly connected bowtie array antenna using a silicon-based integrated passive device (IPD) on a multilayer printed circuit board (PCB) is developed. The proposed IPD antenna is flip-chipped on the PCB through solder balls and gold studs, whereas a vertical coax-via-based feeding structure is used to provide differential excitation. The proposed 5 × 5 array AiP shows a bandwidth of 18.58-100 GHz with differential VSWR ≤ 3.5 when only exciting the central antenna element. The simulations are validated through the fabrication and measurement of prototypes, demonstrating a reasonable agreement in differential VSWR and radiation patterns.