Study of Anisotropic Wet Chemical Etching for Silicon Microneedles Fabrication

This paper presents the study of silicon microneedles patterns of formation by a method of anisotropic wet chemical etching in potassium hydroxide solution. Anisotropic etching speed dependencies from solute concentration and temperature have been obtained. It has been shown, that microneedles with desired height and sharpening angle values could be fabricated in a potassium hydroxide solution with high etching speed. It is necessary to control the ending of the etching process to provide the required sharpening angle for nanodimentional points.