A Hybrid Supply Modulator with Envelop Tracking Technique for RF Power Amplifier

This paper presents a hybrid supply modulator with envelop tracking (ET) technique for radio frequency (RF) power amplifier. The proposed ET technique tracks the envelop signal up to 70 MHz without large distortion and delay, which can reduce heat, enhance battery life and improve the efficiency of the supply modulator affected by high peak-to-average power ratio (PAPR). Indeed, the circuit of the sensing current in the hybrid supply modulator does not use comparators and complex circuits, so it simplifies the circuit, reduces the chip size and lower the power consumption. Consequently, the performance of the proposed hybrid power modulator and compares other works in the literature with good performance, and the frequency bandwidth of the operation signal is 70 MHz. The output voltage range is from 0.45 to 1.35 V with 1.8 V supply voltage, 4.7Ω load resistance, and the load current range is up to 280 mA, The circuit of the hybrid supply modulator with envelop tracking technique has been fabricated in TSMC 0.18 μm CMOS Mixed Signal RF General Purpose MiM Al 1P6M process and the chip area is 1167 μmx 1148 μm.