Concept of a Platinum Hotplate on Thermoisolated Polyimide Membrane

In this paper we present fabrication process of a platinum hotplate as microstructure. Electro-thermal and thermo-mechanical simulations by FEM (Finite Element Method) analysis were performed for the design and optimization of the Pt hotplate. The simulations were focused on the PI (polyimide) membrane thicknesses in the range from 3 to 12 ×m. Calculated von Misses stress in the centre of the hotplate ranged from 130 to 200 MPa for all simulated structures. Electro-thermal simulations showed good temperature distribution on the surface of Pt hotplate. Maximal working temperature was reached on 74% of the PI membrane.