To Study the Low Temperature Diffusion Bonding of AISI 5130 Alloy Steel

Diffusion Bonding (DB) is an effective joining technique which is utilized to achieve similar microstructure and strength as that of parent metal. Recent studies have shown that researchers usually prefer to use metal interlayer between the two joining parent metals, which enhances the diffusivity and compatibility by minimizing the thermal expansion mismatch. Keeping abreast with the latest techniques to improvise mechanical properties it has been observed that these properties are dependent on interlayer's material. The DB technique can be used to join different types of metals like Stainless steel, Titanium, Zircalloy-2, Beryllium and Copper etc. Study has been carried out on alloy steel AISI 5130 which was used to join by DB process. This alloy has many applications in aerospace industry due to its high strength. To join same alloy steel multiple interlayers of Ni, Cu and Ag were introduced on meeting surface by electrolysis. The DB process was carried out at 500 °C for 2 hrs in vacuum furnace with pressure 1×10
^-3
Pa. The Ag layer thickness was varied to optimize the tensile strength of diffusion bond. The metallography and mechanical testing was performed to study the behavior of DB. Metallographs of parallel surfaces to DB showed a homogeneous and uniform adhesion. The tensile strength of DB of the same scheme was achieved as 123 MPa. The tensile samples were fractured in ductile manner without the indication of any brittle intermetallic compound.