On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector

We propose an innovative concept, "On-demand metal deposition by micro-plasma bubble" which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.