Evaluating Film Assisted Molding Packaging for Peizoelectric Micromachined Ultrasonic Transducers

This paper presents the evaluation of Film Assisted Molding (FAM) technology on Piezoelectric micromachined ultrasonic transducers (PMUT) arrays. Film Assisted Molding (FAM) technology can meet the requirement of MEMS exposed windows packaging with low cost and excellent performance. Mechanical clamping study was performed on the PMUT arrays with 80μm diaphragm and all the PMUT diaphragms (<; 5um thickness) were able to withstand the mold clamping force from 20 to 50 ton. FAM packaging was successfully carried out and demonstrated with no incomplete fill, void or sticking. Preliminary study result shows promising result for further evaluations.