3.1 XBOX Series X: A Next-Generation Gaming Console SoC

The XBOX Series X System-on-Chip (SoC) delivers an enormous improvement over the prior generation with up to 2× GPU performance, 3× CPU performance, 2.4x GPU performance/W, 1.7x memory bandwidth and 2× IO bandwidth to feed the additional processing capability and features shown in Fig. 3.1.1. The chip is fabricated in TSMC's N7 process node [6], containing 15.3B transistors on a 360.4mm
²
die. It is packaged in a 52.5x52.5mm
²
BGA using a 12-layer (5-2-5) substrate with 2963 balls and a 0.80mm minimum ball pitch. A die photo is shown in Fig. 3.1.7. The IO-limited chip floorplan is driven by DRAM connections on 3 sides of the chip.