Innovative press pack modules for high power IGBTs

A new IGBT press pack package was developed to meet increasingly challenging requirements for high power converters, such as in power systems applications. The package offers significantly high tolerance to pressure nonuniformity and allows up to 100 kN of stacking pressure while effectively protecting sensitive silicon chips by using a flexible contact concept. The package is resilient to explosion and is designed to provide short circuit contact upon eventual failure. Modular design is adapted to achieve high degree of standardization and provide flexibility in current rating at the same time.