BenzoCycloButene-based in-Package Substrate Integrated Waveguides for sub-THz Applications

This paper introduces an experimental characterization of substrate integrated waveguide (SIW) components integrated in a benzocyclobutene-based interposer for WR10-band applications. High performance SIWs were experimentally validated, with a measured attenuation constant of 0.39 dB/mm and a quality factor of 27 at 90 GHz. The attenuation constant remains equal to 0.4 dB/mm between 85 GHz and 110 GHz and the quality factor reaches 40 in the upper end of the band. These results show the benefits offered by using benzocyclobutene 3D packaging for the realization of high performance passive circuits with lower cost and higher electrical performance as compared to standard CMOS technologies and concurrent packaging technologies.