Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under Thermal Shock and Random Vibration

With the further miniaturization of RF systems, its reliability has become one of the key factors. In this paper, the reliability of a X-band 2×2 tile-type module with ball grid array (BGA) and redistribution lines (RDL) process is discussed. The impact of thermal shock and random vibration on the module is analyzed by finite element analysis (FEA). And the Darveaux life prediction model and the Steinberg's three-interval method based on Gauss distribution and Miner's law are used to predict the life of the BGA. Finally, an improved design is proposed to enhance the reliability of the module.