FEOL Self-heating and BEOL Joule-heating Effects of FinFET Technology and Its Implications for Reliability Prediction

Self-heating effect (SHE, ΔT
_sh
) has been aggravated due to compact layout footprint in advanced FinFE T technology, which needs a significant concern for device performance, variability and reliability co-optimization. In this paper, we characterize and model the FinFE T SHE with technology scaling down as well as BEOL Joule-heating effect (JHE, ΔT
_lh
), demonstrating the device with taller and narrower fin, shorter CPP presents higher ΔT
_sh
, and there is a strong thermal coupling between BEOL metal layers, FEOL and BEOL. Therefore, accurate FEOL SHE and BEOL JHE should be considered for HCI, ON-state TDDB and EM reliability lifetime prediction.