The Reliability of Press-pack IGBT in MMC Based on Electro-Thermo-Mechanical Simulation

Press-pack IGBTs are now widely used in HVDC and FACTS since its extraordinary reliability and high power density. A method to estimate the reliability of press-pack IGBT based on FEM is proposed. A circuit model of MMC was simulated by Simplorer in order to obtain the power loss model of press-pack IGBT. The coupled steady-state simulation of thermal, electrical and mechanical model was analyzed by Workbench. Furthermore, the transient junction swing of IGBT was estimated by a power loss with half sine profile. LESIT lifetime prediction model was used to analyze the lifetime and reliability of press-pack IGBT in MMC system. Press-pack IGBT has high reliability in MMC in long time scale since the low junction temperature of it.