Integration feasibility of porous SiLK* semiconductor dielectric

The feasibility of integrating a SiLK* Semiconductor Dielectric film (*trademark of The Dow Chemical Company) that contains closed pores was studied using a single damascene test vehicle. The study focussed on tool qualification, process set-up and single damascene feasibility to demonstrate technology extendibility. The results indicate that only minor changes have to be made to the process conditions when transitioning from a dense to a porous SiLK* film.