Contact resistance measurement of a 130-nm-diameter poly-Si plug on a lightly doped single diffusion region in giga-bit DRAMs | IEEE Conference Publication | IEEE Xplore

Contact resistance measurement of a 130-nm-diameter poly-Si plug on a lightly doped single diffusion region in giga-bit DRAMs


Abstract:

A practical method to extract the contact resistance of a phosphorus-doped poly-Si plug formed on a lightly phosphorus-doped diffusion region in giga-bit DRAM memory cell...Show More

Abstract:

A practical method to extract the contact resistance of a phosphorus-doped poly-Si plug formed on a lightly phosphorus-doped diffusion region in giga-bit DRAM memory cells is proposed. A contact resistance diameter of 130 nm is experimentally obtained by the substrate bias change measurement, which can separate the resistance of a bias-dependent lightly-doped diffusion layer from the total contact chain resistance. This method is effective for process technology development of a low resistance contact formation in giga-bit DRAMs.
Date of Conference: 19-22 March 2001
Date Added to IEEE Xplore: 07 August 2002
Print ISBN:0-7803-6511-9
Conference Location: Kobe, Japan

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