Etching Polymer Technology for Large Number of Small VIA

In order to increase data capacity and improve signal processing, the IC package is changing to a module package in which an application processor, high bandwidth memory (HBM), and a controller are mounted together. Substrate of module package requires more and smaller vias than single package's substrate to handle high I/O of several chips, and also requires mechanical properties that can withstand structural deformation. Since the formation of a large amount of small vias excessively increases the laser drill cost. Photosensitive materials for low cost are bad in properties. In this study, we will introduce a new photosensitive material of high mechanical strength at low cost.